According to @faridofanani96, the Dimensity 9400 AP will measure 150mm² making it the largest chipset earmarked for a smartphone when it is introduced later this year. This will allow the SoC to carry a large number of transistors along with a bigger Neural Processing Unit (NPU) for AI and Machine Learning. Cache sizes will also be larger and the Dimensity 9400 AP could be equipped with more than 30 billion transistors.
![MediaTek's Dimensity 9300 AP powers the Vivo X100 series - MediaTek's Dimensity 9400 SoC could be packed with more than 30 billion transistors](https://m-cdn.phonearena.com/images/articles/413010-image/d93xx.jpg)
MediaTek’s Dimensity 9300 AP powers the Vivo X100 series
The tweet from @negativeonehero shows an image from the Vulkan GPUInfo database supposedly showing that the Dimensity 9400 SoC will feature the Mali-TKRX MC12 GPU. One rumor calls for a 20% performance hike in graphics over the Dimensity 9300 SoC which could be enough for MediaTek’s new flagship smartphone chip to top the graphics performance of the upcoming Snapdragon 8 Gen 4 chipset.
![This screenshot from the Vulkan GPUInfo database reportedly shows the GPU that the Dimensity 9400 SoC will feature - MediaTek's Dimensity 9400 SoC could be packed with more than 30 billion transistors](https://m-cdn.phonearena.com/images/articles/413011-image/94gpu.jpg)
This screenshot from the Vulkan GPUInfo database reportedly shows the GPU that the Dimensity 9400 SoC will feature
TSMC will be manufacturing the Dimensity 9400 AP using its second-generation 3nm node (N3E) and all things considered, this will probably be the most expensive smartphone chipset ever designed by MediaTek.
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